When I change filaments via the glcd, I park nozzle I heat nozzle, purge, remove the extruded purge, unload, using purging filament (repeat), then load the filament, and then cool the nozzle.
The problem is, when I unload (two times in above process), the firmware first extrudes a tiny bit more filament and then drops the hot nozzle down on or very near the bed.
This doesn’t seem optimal in my view on two counts. First hot nozzle, second it extrudes a tiny bit before unloading. The little filament often gets pushed onto the outside of the nozzle.
Seems to me it would be better to keep the head parked, allow the user to clean off that little piece of filament extruded during the unload, and then allow the user to cool the nozzle and move the head wherever he wants.
Is there a way to change this behavior short of creating my own custom firmware build with modified code?
Of does it sound like I have something configured incorrectly.
The way it is now the outside of the nozzle is getting unnecessarily polluted, and I’m not sure if the pei on the bed is getting damaged, but I’ll keep an eye out.