Stratasys' New Patent

I was wondering if anyone saw the new patent that Stratasys recently acquired. It is basically a way of slicing the model so that you don’t get any noticeable artifacts where the current layer stops and the new one starts. What are your thoughts about something like this being patented?

If someone spends time and effort on researching and creating a novel solution, should they not be rewarded for those efforts if they deem to share the techniques in detail for others to build from?

The issue for me is not patents, but the length of protection the patent awards and the lack of regulation for good faith licensing when the patent owner is not actively pursuing the use of the patent.